Meyer Burger, New efficient wire saw with diamond wire and wire management (DW288.3)
Solar Industry, Switzerland
Meyer Burger, New efficient wire saw with diamond wire and wire management (DW288.3)
Solar Industry, Switzerland
Machine Building
Meyer Burger AG
The production of wafers is very cost-intensive and there is an increasing trend towards more highly efficient, thinner wafers. Therefore, the challenge was to build a reliable machine with the highest throughput to increase productivity and significantly lower the costs per wafer. Cutting times per wafer had to be reduced; the service life of the expensive diamond wire had to be optimized and material consumption thus minimized.
The high-performance control and drive technology from Siemens provides optimal wire-pull and speed control, which enables the use of a thinner wire for cutting the wafers. In combination with the integrated safety technology, the compact IO system and an integrated PROFINET network, we were able to construct an efficient, future-proof machine (Wiresaw DW288.3) that meets standard guidelines and allows the production of crystalline wafers at the lowest costs.
Used Products:
SIMATIC IPC427D
SIMATIC WinAC RTX F
SIMATIC Industrial Flat Panel PRO
SINAMICS S120 built-in units
1FK7 servomotors
SIMATIC ET 200SP
"The machine operates at the limit of what is possible today. Integrated automation technology is therefore a central element for highest process safety."
Gunter Erfurt, COO, Meyer Burger Technology AG
Higher productivity, lower costs per wafer
In detail:
50% more wafers per unit of time – thanks to optimized drive technology (SINAMICS S120 with DCC and SIMOTICS motors) the wire can be kept at a constant tension even at high acceleration.
High throughput, minimal downtimes because wire breaks are prevented (optimal wire guiding thanks to SINAMIC S120)
Material savings of up to $100,000 per year and machine thanks to thin-wire capability (diamond-studded wire)
Increased process safety thanks to efficient, optimized cutting process based on integrated automation concept. High-performance, failsafe controller, modern Profinet bus system including Safety for quick and easy diagnostics.
Meyer Burger, New efficient wire saw with diamond wire and wire management (DW288.3)
Location:
Gwatt
(Thun), Switzerland. 400 employees; in total: 1,500 employees on three
continents: Europe, Asia, North America.
Meyer Burger is a leading and globally active technology company for innovative processes based on semiconductor technologies with a focus on the solar industry. The range of systems, production plants and services along the value chain includes wafering processes, solar cells, solar modules and solar systems.
Reference
application: New generation of wire saw for increased productivity in wafer
production while reducing costs
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